Chip Research Pushes AI Limits, From HBM to Quantum Photonics

Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating and rad-hard; monolithic CMOS-photonic integration; quantum photonic chips; AI-driven thermal modeling for 3D photonic circuits. The post Chip Industry Technical Paper Roundup: July 21 appeared first on Semiconductor Engineering .